reflower
Do not inhale the vapor during reflow.
不要吸入回流焊时喷出的蒸气。
Adapted to the reflow soldering.
适应于回流焊接。
Suit for reflow and wave flow solder.
适应再流焊与波峰焊。
Suitable reflow and wave soldering.
适合于回流焊和波峰焊
Clear how to measuring reflow and wave profile.
清楚怎样测量回流焊和波峰焊温度曲线。
Reflow solder paste in 2 hours as soon as possible after printing.
印刷后要在2小时内回流焊膏。
Should a nitrogen atmosphere be used in the reflow process?
回流工艺中是否应使用氮气?
Your next BEST choice in Lead Free capable reflow oven.
您的下一个最佳的无铅回流焊炉的选择一定是保乐。
Compatible with infrared and vapor phase reflow solder process.
适用于回流焊接工艺。
The most obvious is the necessity for increased reflow temperature.
最明显的是，使用无铅锡膏必须提高回流焊温度。
The reflow process relies on the temperature profile setting.
回流过程依赖于温度曲线的设定。
What happens to no-clean flux residues at the higher reflow temperatures?
较高的回流温度会对免清洗焊剂的残留物造成怎样的影响?
The reasons of reflow discoloration of tin deposit on connector were analyzed.
分析了连接器锡镀层发生回流变色的原因。
In SMT reflow soldering process,profiling a PCBA is a extremely important step.
在SMT回流焊的整个流程中，为组装电路板设定合适的温度分布曲线是十分重要的一个环节。
At the same time,experiments on PBGA solder ball laser reflow were carried out.
同时，本文还对PBGA钎料球激光重熔进行了试验研究。
Peak soldering reflow temperature also impacts cleaning performance.
再流焊的峰值温度也会对清洗性能造成影响。
Through-hole reflow is a new concept of the contemporary assembly technolog y.
介绍了通孔回流焊的概念、特点、分类和使用工艺要点。
Are outputted boards at least sample inspected pre reflow for placement, missing components, and solder defects?
回流焊输出之板是否至少抽样检查板的置件精度,有无少件和不良焊点?
A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants.
关于单遍高可靠性倒装片回流密封剂领域研发工作成就的综述。
Will the higher temperatures needed for melting lead-free solder create more fumes and condensate in the reflow oven?
熔化无铅焊料所需的高温是否会在回流炉中产生较多的烟雾和冷凝物?
Control can resize or reflow its child controls as the dimensions of the parent form change.
控件可以调整其子控件的大小和流动。
Excellent in solderability and high heat resistance with either flow or reflow soklering.
可焊性和耐焊性优,适用于流焊和再流焊。
What other issues can be expected with the conversion to lead-free reflow soldering?
转变到无铅回流焊接还会遇到什么问题?
Lead-free wave soldering, wave soldering wave peak welding machines, reflow soldering machine.
无铅波峰焊,波波峰焊,峰焊接机,回流焊接机。
A general profile setting up a wave solder machine to optimize reflow using an alcohol base flux.
一种常规温度特性曲线,用于对波焊机进行设置,对采用以酒精为基本成分的焊剂回流进行优化。
A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.
在迴焊过程中,因BGA锡球内孔隙有气体溢出而形成吹孔.
The selection of under bump metal(UBM),the reflow and quality control of bumping are described.
描述了凸点下金属(UBM)层的选择,凸点回流技术,以及凸点的质量控制技术;
During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure.
在下一个回流工序，锡膏浸润焊盘表面，形成一个固态锡膏凸起。
After reflow soldering and restored at room temperature, they meet the characteristics listed below.
經過回流焊並冷卻至室溫後，電容器的特性符合下表的要求。
Intracoronary bivalirudin for no reflow reversal: a second chance to treat this disorder?
冠脉内给予比伐卢定，治疗无再流的第二个选择？
Aim To explore the relationship between NO and no reflow on reperfusion injury of skeletal muscle.
目的：探讨一氧化氮与肢体骨骼肌再灌流损伤无再流变化的关系。
It also offers the benefit of being extremely thermally stable and maintaining a soft, pliable residue after reflow.
这种焊锡膏正是针对这些要求而设计的。它的热稳定性极好，再流焊后的残留物是柔软的。
The main products: silk screen machines, Dianjiao Ji, Mounter, reflow, wave soldering SMT-related tools and supplies.
公司主要经营：丝印机、点胶机、贴片机、回流焊、波峰焊及SMT相关工具耗材。
Adhering tin is the main cause that reflow conductor roll abates which works in the electroplating tin line (ETL).
粘锡是电镀锡机组软熔导电辊失效的主要原因,应用化学方法脱锡是延长导电辊寿命的重要途径。
It is applicable to the printing and reflow of general surface No side balling and heat collapse, etc. occurrence.
适合一般表面焊接之印刷及回流使用，无锡球及热塌陷问题出现。
An example is a pre-reflow misaligned chip component.This component may or may not self-align in the reflow oven.
例如，再流前对准不良的片式元件，这种元件在再流炉中可能会自对准，也可能不会。
In the reflow process, this means monitoring the thermal profile of every production board.
在再流工艺控制中，这意味着要对制造的每块板子的热曲线进行监控。
In the course of the lead free reflow soldering,lead and Lead free of reflow soldering affect the quality of product.
在再流焊无铅化过程中,再流焊的有铅要素与无铅要素的兼容性直接影响产品质量。
Development of advanced electronic package devices promoted the study on the reflow soldering.
先进电子封装器件的出现推动了再流焊方法和设备的研究。
If capacitors are subject to the conditions other than the allowable. range of reflow , please contact to us.
如果电容器承受的条件与回流焊的允许范围不同,请与我们联系.
Solder paste is essential material in SMT, which is widely used in reflow soldering.
焊膏是SMT工艺中不可缺少的钎焊材料,广泛应用于再流焊中;
These factors include type of benzimidazole, thickness of film, times of reflow welding, thermal impact, and assistant.
结果表明,不同类型的咪唑化合物可焊性存在明显差异,可焊性有一最优的厚度。
No-flow underfill materials that cure during the solder reflow process is a relatively new technology.
在精细金属线条的连铸过程中，影响铸件品质的因素很多，所以有必要对不同的操作条件作影响评估。
Is there a point and click software tool post reflow which is linked to CAD or program data to facilitate component identification for rework?
在过回流焊时有无同CAD或程式数据相联系的软件工具来帮助实现元件的确认与返工?
It is compatible with automatic placement equipment and is designed for either reflow soldering or a lead (Pb)-free solder process.
该器件可与自动贴装设备兼容,并且面向再流焊接或无铅(Pb)焊接工艺而设计。
Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊:应用加热金属涂敷层的表面和预涂焊膏,熔融,连接和凝固两个金属涂层。
Kester proudly announces that it has been awarded a patent for its Reflow Encapsulant technology including material and method of use.
凯斯特骄傲地宣布,它已获得回流密封剂技术(其中包括材料和使用方法)的专利。
Pin-testable flux residues remain soft after reflow and will be pin-testable, the flux is designed not to harden at the higher peak temperatures.
可探针测试残留物回流后依然保持柔软状态,因而可以使用探针测试,该种焊剂在较高的峰值温度下不会变硬。
No less than 2 years SMT technics work experience, Be proficient in screen , reflow profile and printing setup and modify.
至少两年的SMT工艺工作经验,熟练掌握,精通印刷丝网,回流温度曲线及印刷工艺的设定及修改.
Delamination caused by electrical-over-stress (EOS) and moisture expansion during reflow soldering have shown different delamination patterns.
由过电应力(EOS)和再流焊中的水汽膨胀引起的分层会显示出不同的失效模式。